| PART |
Description |
Maker |
| 21-0042 |
PACKAGE OUTLINE, SOIC,300
|
Maxim Integrated Products
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
| SSOP24 |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
|
STMicroelectronics
ST Microelectronics
|
| AP2321GN-HF AP2321GN-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2318GEN-HF AP2318GEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP9451GG |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2622GY-12 |
Low Gate Charge, Small Package Outline
|
Advanced Power Electron...
|
| AP2326GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
